Integrated Inductors for RF Transmitters in CMOS/MEMS Smart Microsensor Systems
نویسندگان
چکیده
This paper presents the integration of an inductor by complementary metaloxide-semiconductor (CMOS) compatible processes for integrated smart microsensor systems that have been developed to monitor the motion and vital signs of humans in various environments. Integration of radio frequency transmitter (RF) technology with complementary metal-oxide-semiconductor/micro electro mechanical systems (CMOS/ MEMS) microsensors is required to realize the wireless smart microsensors system. The essential RF components such as a voltage controlled RF-CMOS oscillator (VCO), spiral inductors for an LC resonator and an integrated antenna have been fabricated and evaluated experimentally. The fabricated RF transmitter and integrated antenna were packaged with subminiature series A (SMA) connectors, respectively. For the impedance (50Ω) matching, a bonding wire type inductor was developed. In this paper, the design and fabrication of the bonding wire inductor for impedance matching is described. Integrated techniques for the RF transmitter by CMOS compatible processes have been successfully developed. After matching by inserting the bonding wire inductor between the on-chip integrated antenna and the VCO output, the measured emission power at distance of 5 m from RF transmitter was -37 dBm (0.2 μW).
منابع مشابه
Fabrication of RF MEMS Components on CMOS Circuits
Recently deep submicron and SiGe (silicongermanium) bipolar CMOS technologies have enhanced the performance of Si-based radio frequency (RF) integrated circuits up to microwave frequencies. The integration of RF MEMS components, such as inductors and capacitors, could further improve the performance of key RF circuit blocks such as voltage controlled oscillators (VCO), low-noise amplifiers, fil...
متن کاملFully Integrated Low Phase-Noise VCOs With On-Chip MEMS Inductors
We present fully integrated high-performance voltage-controlled oscillators (VCOs) with on-chip microelectromechanical system (MEMS) inductors for the first time. MEMS inductors have been realized from the unique CMOS-compatible MEMS process that we have developed to provide suspended thick metal structures for high-quality ( ) factors. Fully integrated CMOS VCOs have been fabricated by monolit...
متن کاملChip-level integration of RF MEMS on-chip inductors using UV-LIGA technique
This paper presents a chip-level integration of radio-frequency (RF) microelectromechanical systems (MEMS) air-suspended circular spiral on-chip inductors onto MOSIS RF circuit chips of LNA and VCO using a multi-layer UV-LIGA technique including SU-8 UV lithography and copper electroplating. A high frequency simulation package, HFSS, was used to determine the layout of MEMS on-chip inductors wi...
متن کاملMicromachined planar inductors on silicon wafers for MEMS applications
This paper describes three micromachined planar inductors (a spiral type, a solenoid type, and a toroidal meander type) with electroplated nickel–iron permalloy cores which have been realized on a silicon wafer using micromachining techniques. The electrical properties among the fabricated inductors are compared and the related fabrication issues are discussed, with emphasis on the low-temperat...
متن کاملHigh performance MEMS 0.18 μm RF-CMOS transformers
This work presents a micromachined RF-CMOS transformer fabricated in a commercially available 0.18μm CMOS process. Maskless micromachining post-processing is used to remove oxide and substrate material from around the transformer, reducing parasitic effects and improving the performance of the transformer. Index Terms — baluns, CMOS integrated circuits; MEMS, maskless micromachining, Q enhancem...
متن کامل